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HT36B2 8-Bit Music Synthesizer MCU
Features
* Operating voltage: 3.6V~5.0V * Operating frequency: 3.58MHz~12MHz * Sampling rate of 44.1kHz as 11.059MHz for system
frequency
* Eight-level subroutine nesting * HALT function and wake-up feature to reduce power
(typ. 11.059MHz)
* 32 bidirectional I/O lines * Two 16-bit programmable timer/event counters with
consumption
* Bit manipulation instructions * 16-bit table read instructions * 63 powerful instructions * All instructions in 1 or 2 machine cycles * 28-pin SOP, 56-pin SSOP package
overflow interrupts
* Watchdog Timer * Built-in 8-bit MCU with 5768 bits RAM * Built-in 128K16-bit ROM for program/data shared * Two High D/A converter resolution: 16 bits * Polyphonic up to 16 notes * Independent pan and volume mix can be assigned to
each sound component
General Description
The HT36B2 is an 8-bit high performance RISC-like microcontroller specifically designed for music applications. It provides an 8-bit MCU and a 16 channel wavetable synthesizer. The program ROM is composed of both program control codes and wavetable voice codes, and can be easily programmed. The HT36B2 has a built-in 8-bit microprocessor which programs the synthesizer to generate the melody by setting the special register from 20H~2AH. A HALT feature is provided to reduce power consumption.
Block Diagram
VD VS VD VS S te re o 1 6 - B it DAC D DA SA S
PA PB PC PD
0~ 0~ 0~ 0~
PA PB PC PD IN OSC OSC T RES
7
7
7
7
1 2 8 K 1 6 - b it ROM 8 - B it MCU 5768 RAM M u ltip lie r /P h a s e G e n e ra l
1 2
RCH LCH
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HT36B2
Pin Assignment
VDD RES PC7 PC6 PC5 PC4 PC3 PC2 NC NC NC NC NC NC VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VDD RES NC NC NC NC NC NC NC NC PA7 PA6 PA5 28 27 26 25 24 23 22 21 20 19 18 17 16 15 OSC1 OSC2 VSSA VDDA LCH RCH NC NC IN T PA0 PA1 PA2 PA3 PA4 NC NC NC NC NC PC1 PC0 PB7 PB6 PB5 PB4 PB3 PB2 PB1 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 8 7 6 5 4 3 2 1 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 VSS OSC1 OSC2 VSSA VDDA LCH RCH PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 NC NC NC IN T PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7 PB0
H T36B 2 2 8 S O P -A
H T36B 2 5 6 S S O P -A
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HT36B2
Pad Assignment
VDDA OSC2 OSC1 VSSA RCH VDD RES VSS LCH PC4 41 PC6 PC5 PC2 1 2 PC1 PC7 PC3 42 3 PC0
40
39
38
37
36
35
34
33
32
31
30
29
28 27 26 25 (0 , 0 ) 24 23 22 21
PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7
4 PB7
5 PB6
6 PB5
7 PB4
8
9
10 PB1
11 PB0
12 PA7
13 PA6
14 PA5
15 PA4
16 PA3
17 PA2
18 PA1
19 PA0
20 IN T
* The IC substrate should be connected to VSS in the PCB layout artwork.
PB2 PB3
Chip size: 117.1 139.8 (mil)
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HT36B2
Pad Coordinates
Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 X -1327.608 -1321.808 -1221.808 -1111.208 -1011.208 -900.608 -800.608 -690.008 -590.008 -479.408 -379.408 -268.808 -168.808 -58.208 41.792 152.392 252.392 362.992 462.992 571.392 1320.992 Y 1607.250 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -1607.630 -257.280 Pad No. 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 X 1320.992 1320.992 1320.992 1320.992 1320.992 1320.992 1320.992 1324.492 1211.492 1099.052 950.392 833.168 155.316 34.192 -572.908 -694.032 -795.808 -906.408 -1006.408 -1117.008 -1217.008 Y -146.680 -46.680 63.920 163.920 274.520 374.520 485.120 1571.300 1571.300 1571.300 1571.300 1571.200 1571.200 1604.750 1604.750 1607.250 1607.250 1607.250 1607.250 1607.250 1607.250 Unit: mm
Pad Description
Pad Name PA0~PA7 PB0~PB7 PC0~PC7 PD0~PD7 INT RCH LCH VDDA VSSA OSC1 OSC2 VSS VDD RES I/O I/O I/O I/O I/O I O O 3/4 3/4 I O 3/4 3/4 I Internal Connection Pull-High or None Pull-High or None Pull-High or None Pull-High or None Pull-High 3/4 3/4 3/4 3/4 Function Bidirectional 8-bit Input/Output port, wake-up by mask option Bidirectional 8-bit Input/Output port Bidirectional 8-bit Input/Output port Bidirectional 8-bit Input/Output port External interrupt R channel audio output L channel audio output DAC power supply Negative power supply of DAC, ground OSC1 and OSC2 are connected to an RC network or a crystal (by mask option) for the internal system clock. In the case of RC operation, OSC2 is the output terminal for 1/8 system clock. The system clock may come from the crystal, the two pins cannot be floating. Negative power supply, ground Positive power supply Reset input, active low
3/4
3/4 3/4 3/4
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HT36B2
Absolute Maximum Ratings
Supply Voltage .............................VSS-0.3V to VSS+6V Input Voltage .............................VSS-0.3V to VDD+0.3V Storage Temperature ...........................-50C to 125C Operating Temperature ..........................-25C to 70C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maximum Ratings may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
Symbol VDD IDD ISTB IOH IOL VIH VIL RPH Parameter Operating Voltage Operating Current Standby Current (WDT Disabled) I/O Ports Source Current I/O Ports Sink Current Input High Voltage for I/O Ports Input Low Voltage for I/O Ports Test Conditions VDD 3/4 4.5V 4.5V Conditions 3/4 No load, fOSC=11.0592MHz No load, System HALT Min. 3.6 3/4 3/4 5 5 0.8VDD 0 3/4 Typ. 4.5 16 1 3/4 3/4 3/4 3/4 30 Max. 5.5 32 3 3/4 3/4 VDD 0.2VDD 3/4
Ta=25C Unit V mA mA mA mA V V kW
4.5V VOH=4.5V 4.5V VOL=0.5V 4.5V 4.5V 3/4 3/4
Pull-High Resistance of I/O Ports (INT) 4.5V VIL=0V
A.C. Characteristics
Symbol MCU interface fOSC fSYS tWDT tRES System Frequency System Clock Watchdog Time-Out Period (RC) External Reset Low Pulse Width 5V 5V 3/4 3/4 11.059MHz crystal 3/4 Without WDT prescaler 3/4 3/4 8 9 1 11.059 3/4 17 3/4 3/4 12 35 3/4 MHz MHz ms ms Parameter Test Conditions VDD Conditions Min. Typ. Max. Unit
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HT36B2
Application Circuit
V 10W 0 .1 m F 47mF VDDA VDD LCH 20kW 47mF 0 .1 m F 2 IN 8 VDD 1 VSS 4 5 7 OUTP H T82V733 CE OUTN SPK 8W
DD
V
DD
OSC1 1 1 .0 5 9 M H z OSC2 V
DD
PA0~PA7 PB0~PB7 PC 0~PC 7 PD 0~PD 7
V re f 3 10mF
V 47mF
DD
RCH 100kW RES 0 .1 m F H T36B 2 VSSA VSS 20kW
0 .1 m F 2
IN
8 VDD 1 VSS 4 5 7 H T82V733 CE
OUTN SPK 8W OUTP
V re f 3 10mF
V 10W 0 .1 m F 47mF VDDA
DD
VDD
V
DD
LCH
1kW 750W
SPK 8W
OSC1
PA0~PA7 PB0~PB7 PC 0~PC 7 V
DD
V
DD
PD 0~PD 7 1kW 750W
SPK 8W
100kW RES 0 .1 m F H T36B 2
RCH VSSA VSS
Rev. 1.00
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HT36B2
Package Information
28-pin SOP (300mil) Outline Dimensions
28 A
15 B
1
14
C C' G H D E F
a
Symbol A B C C D E F G H a
Dimensions in mil Min. 394 290 14 697 92 3/4 4 32 4 0 Nom. 3/4 3/4 3/4 3/4 3/4 50 3/4 3/4 3/4 3/4 Max. 419 300 20 713 104 3/4 3/4 38 12 10
Rev. 1.00
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HT36B2
56-pin SSOP (300mil) Outline Dimensions
56 A 1 C C'
29 B 28
G H a F
D E
Symbol A B C C D E F G H a
Dimensions in mil Min. 395 291 8 720 89 3/4 4 25 4 0 Nom. 3/4 3/4 3/4 3/4 3/4 25 3/4 3/4 3/4 3/4 Max. 420 299 12 730 99 3/4 10 35 12 8
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HT36B2
Product Tape and Reel Specifications
Reel Dimensions
T2 D
A
B
C
T1
SOP 28W (300mil) Symbol A B C D T1 T2 Description Reel Outer Diameter Reel Inner Diameter Spindle Hole Diameter Key Slit Width Space Between Flange Reel Thickness Dimensions in mm 3301.0 621.5 13.0+0.5 -0.2 2.00.5 24.8+0.3 -0.2 30.20.2
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HT36B2
Carrier Tape Dimensions
D
E F
P0
P1
t
W C
B0
D1
P
K0 A0
SOP 28W (300mil) Symbol W P E F D D1 P0 P1 A0 B0 K0 t C Description Carrier Tape Width Cavity Pitch Perforation Position Cavity to Perforation (Width Direction) Perforation Diameter Cavity Hole Diameter Perforation Pitch Cavity to Perforation (Length Direction) Cavity Length Cavity Width Cavity Depth Carrier Tape Thickness Cover Tape Width Dimensions in mm 24.00.3 12.00.1 1.750.1 11.50.1 1.5+0.1 1.5+0.25 4.00.1 2.00.1 10.850.1 18.340.1 2.970.1 0.350.01 21.3
Rev. 1.00
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July 3, 2003
HT36B2
Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shanghai Sales Office) 7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233 Tel: 021-6485-5560 Fax: 021-6485-0313 http://www.holtek.com.cn Holtek Semiconductor Inc. (Shenzhen Sales Office) 43F, SEG Plaza, Shen Nan Zhong Road, Shenzhen, China 518031 Tel: 0755-8346-5589 Fax: 0755-8346-5590 ISDN: 0755-8346-5591 Holtek Semiconductor Inc. (Beijing Sales Office) Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031 Tel: 010-6641-0030, 6641-7751, 6641-7752 Fax: 010-6641-0125 Holmate Semiconductor, Inc. (North America Sales Office) 46712 Fremont Blvd., Fremont, CA 94538 Tel: 510-252-9880 Fax: 510-252-9885 http://www.holmate.com Copyright O 2003 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holteks products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw.
Rev. 1.00
11
July 3, 2003

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